NVIDIA/Mellanox MMA4Z00-NS-FLT Broadcom DSP & Broadcom VCSEL Compatible 800G OSFP 2xVR4/VR8 850nm 50m PAM4 DOM Two MPO-12/APC MMF Transceiver Module (Flat Top) for ConnectX-8 C8180 SuperNIC

#103238
Model: OSFP-800G-2VR4F | SKU: 980-9I51A-00NS00
Sold: 490
In Stock: 400
US$ 739.00

Item Spotlights

  • Built-in Broadcom DSP & Broadcom VCSEL, Maximum Power Consumption ≤14W.
  • Provide Professional Compatibility and Parameter Test Reports.
  • Compliant with Hot Pluggable OSFP MSA Standard.
  • Compliant with RoHS Environmental Standard (Lead-free).
  • DDM(Digital Diagnostic Monitoring) Supported.
  • Pairing with the C8180 Super NIC enables quad-Plane topology networking and effectively improves link stability.
  • 30-Day Free Return, 1-Year Free Replacement, 3-Year Warranty, Lifetime After-sales Technical Support.
800G OSFP VR8 50m MMF Module for NVIDIA/Mellanox (Flat Top)
NVIDIA/Mellanox MMA4Z00-NS-FLT Broadcom DSP & Broadcom VCSEL Compatible 800G OSFP 2xVR4/VR8 850nm 50m PAM4 DOM Two MPO-12/APC MMF Transceiver Module (Flat Top) for ConnectX-8 C8180 SuperNIC
Specifications
Applications
Product Highlights
Questions & Answers
Resources
Specifications
Applications
Product Highlights
Questions & Answers
Resources

Description

NVIDIA/Mellanox MMA4Z00-NS-FLT Compatible Broadcom DSP & Broadcom VCSEL 800G 2xVR4/VR8 Optical Transceiver Module for ConnectX-8 C8180 SuperNIC (Twin-port OSFP, 850nm, 50m, Two MPO-12/APC, DOM, for MMF, Flat Top)

NADDOD NVIDIA/Mellanox MMA4Z00-NS-FLT compatible OSFP-800G-2VR4F optical transceiver is designed for 800Gb/s Ethernet interconnects, using a twin-port OSFP architecture to support 2×400Gb/s VR4/VR8 multimode transmission over an 8-channel parallel optical interface. The module operates via two MPO-12/APC connectors, with each connector carrying four optical lanes, and uses 100G-PAM4 modulation to enable short-reach transmission of up to 50 meters over multimode fiber. Built-in Broadcom DSP & Broadcom VCSEL, it is compatible with NVIDIA ConnectX-8 C8180 SuperNIC, ensuring reliable, high-speed data transmission in demanding deployments.

By adopting a parallel multimode VR4/VR8 design, the OSFP-800G-2VR4F enables high port density and efficient short-reach connectivity within 800G switching systems. Finned-top OSFP shells are supported to meet the additional cooling requirements of 800G OSFP switches, while a flat-top variant is available for ConnectX-8 system links, providing deployment flexibility across different platform designs.

Specifications

Form Factor
Twin-port OSFP
Distance
50m
Wavelength
850nm
Connector
Two MTP/MPO-12 APC
Power Consumption
≤14W
Transmitter
VCSEL
Receiver
PIN
Media
MMF
Modulation(electrical)
8x106.25Gb/s PAM4
Modulation(Optical)
Two ports 4x106.25Gb/s PAM4
Case Temperature(℃)
0 to 70°C (32 to 158°F)
Protocol
800G Ethernet Compliant

Applications

Product Highlights

ConnectX-8 Multi-Plane Architecture Unlocks Extreme Cluster Performance

The OSFP-800G-2VR4F module is tightly integrated with the C8180 SuperNIC’s multi-plane architecture, delivering key advantages in large-scale computing clusters. By distributing traffic across multiple planes, it maximizes bandwidth, enables smoother load balancing, and ensures consistently low latency. Each plane is isolated and inherently redundant, so a single path failure does not impact service continuity, enhancing overall reliability. With higher resource utilization and fewer congestion points, the ConnectX-8 architecture enables faster scaling and a more efficient, stable, and resilient network experience.

The Cost-Efficient, High-Performance C8180 SuperNIC Solution

In ConnectX-8 NIC and Spectrum-4 switch AI cluster architectures, the C8180 paired with OSFP-800G-2VR4F reduces optical module count by 20% compared with the C8240 using Q112-400G-VR4 solution. This delivers the following three key advantages.

Questions & Answers

Ask a Question
Q:
What is the difference between Flat top and Finned-top OSFP 800G 2xVR4 optical modules?
A:
The "Flat Top" 800G OSFP module is mainly used in the ConnectX-8 NIC, which have internal heat sinks mounted on top of the cages. The "Finned Top" optical module form factor utilizes a module top design with heat sink fins to increase heat dissipation and improve module performance and reliability in high-temperature environments, and is typically used in air-cooled switches for additional cooling due to the reduced airflow inlet in the switch.
Q:
Are the specifications of the OSFP-800G-2xVR4F identical to those of the OSFP-800G-2xVR4? Are they compatible for interconnection?
A:
Yes, these two modules share identical parameter specifications. The difference lies in their heat dissipation methods. They can be connected using two M4MPOA12FB jumpers.