NVIDIA/Mellanox Compatible Coherent VCSEL & Broadcom DSP 800G OSFP 2xSR4/SR8 850nm 100m PAM4 DOM Two MPO-12/APC MMF Transceiver Module (Flat Top) for ConnectX-8 C8180 SuperNIC

#102869
Model: OSFP-800G-2SR4F
Sold: 242
In Stock: 56
US$ 759.00

Item Spotlights

  • Built-in Broadcom DSP & Coherent VCSEL, Maximum Power Consumption ≤14W.
  • Provide Professional Compatibility and Parameter Test Reports.
  • Compliant with Hot Pluggable OSFP MSA Standard.
  • Compliant with RoHS Environmental Standard (Lead-free).
  • DDM(Digital Diagnostic Monitoring) Supported.
  • Pairing with the C8180 Super NIC enables quad-Plane topology networking and effectively improves link stability.
  • 30-Day Free Return, 1-Year Free Replacement, 3-Year Warranty, Lifetime After-sales Technical Support.
800G OSFP SR8 100m MMF Module for NVIDIA/Mellanox (Flat Top)
NVIDIA/Mellanox Compatible Coherent VCSEL & Broadcom DSP 800G OSFP 2xSR4/SR8 850nm 100m PAM4 DOM Two MPO-12/APC MMF Transceiver Module (Flat Top) for ConnectX-8 C8180 SuperNIC
Specifications
Applications
Product Highlights
Questions & Answers
Resources
Specifications
Applications
Product Highlights
Questions & Answers
Resources

Description

NVIDIA/Mellanox Compatible Coherent VCSEL & Broadcom DSP 800G 2xSR4/SR8 Optical Transceiver Module for ConnectX-8 C8180 SuperNIC (Twin-port OSFP, 850nm, 100m, Two MPO-12/APC, DOM, for MMF, Flat Top)

NADDOD NVIDIA/Mellanox compatible OSFP-800G-2SR4F is an Ethernet 800Gb/s 2x400Gb/s Twin-port OSFP, 2xSR4/SR8 multimode, parallel, 8-channel transceiver using two 4-channel MPO-12/APC optical connectors at 400Gb/s each. The parallel 8-channel design adopts 100G-PAM4 modulation and supports up to 100 m transmission over 8 multimode fibers. Built-in Coherent VCSEL & Broadcom DSP, it is compatible with NVIDIA ConnectX-8 C8180 SuperNIC, ensuring stable signal integrity and high-speed 800G optical performance. Finned-top OSFP shells provide enhanced thermal dissipation for 800G switches, while flat-top versions are available for ConnectX-8 system links.

The Twin-port 2xSR4/SR8 architecture enables efficient 2×400G breakout from a single 800G port, improving port density and deployment flexibility. It is well suited for high-bandwidth, low-latency optical fabrics in AI and HPC clusters, delivering scalable 800G connectivity with optimized power efficiency and reliable performance in high-density environments.

Specifications

Form Factor
Twin-port OSFP
Distance
100m
Wavelength
850nm
Connector
Two MPO-12/APC
Power Consumption
≤14W
Transmitter
VCSEL
Receiver
PIN
Media
MMF
Modulation(electrical )
8x106.25Gb/s PAM4
Modulation(Optical )
Two ports 4x106.25Gb/s PAM4
Case Temperature(℃)
0 to 70°C (32 to 158°F)
Protocol
800G Ethernet Compliant

Applications

Product Highlights

ConnectX-8 Multi-Plane Architecture Unlocks Extreme Cluster Performance

The OSFP-800G-2SR4F module is tightly integrated with the C8180 SuperNIC’s multi-plane architecture, delivering key advantages in large-scale computing clusters. By distributing traffic across multiple planes, it maximizes bandwidth, enables smoother load balancing, and ensures consistently low latency. Each plane is isolated and inherently redundant, so a single path failure does not impact service continuity, enhancing overall reliability. With higher resource utilization and fewer congestion points, the ConnectX-8 architecture enables faster scaling and a more efficient, stable, and resilient network experience.

The Cost-Efficient, High-Performance C8180 SuperNIC Solution

In ConnectX-8 NIC and Spectrum-4 switch AI cluster architectures, the C8180 paired with OSFP-800G-2SR4F reduces optical module count by 20% compared with the C8240 using Q112-400G-SR4 solution. This delivers the following three key advantages.

Questions & Answers

Ask a Question
Q:
What is the difference between Flat top and Finned-top OSFP 800G 2xSR4 optical modules?
A:
The "Flat Top" 800G OSFP module is mainly used in the ConnectX-8 NIC, which have internal heat sinks mounted on top of the cages. The "Finned Top" optical module form factor utilizes a module top design with heat sink fins to increase heat dissipation and improve module performance and reliability in high-temperature environments, and is typically used in air-cooled switches for additional cooling due to the reduced airflow inlet in the switch.
Q:
Are the specifications of the OSFP-800G-2xSR4F identical to those of the OSFP-800G-2xSR4? Are they compatible for interconnection?
A:
Yes, these two modules share identical parameter specifications. The difference lies in their heat dissipation methods. They can be connected using two M4MPOA12FB jumpers.