Support wire-speed L2/L3 forwarding, located in the Leaf layer of traditional cloud center and SDN cloud center scenarios, meeting the network deployment requirements of AI, HPC, HDFS, DT and other application scenarios.

Non-blocking CLOS architecture data center network for high performance, high availability and resilient network requirements.

support for over-current, over-voltage and over-heat protection, and non-intermittent power supply for terminal equipment greatly improve the stability of the network. Independent BMC module design, can monitor the device's CPU, memory and other information, device restart can still monitor the device status.

M-LAG (cross-device link aggregation) allows link aggregation between multiple devices. Stacking can combine several devices into a whole device for use. Both the two functions can meet the demands for different scenarios.