NVIDIA/Mellanox MMS4A00-XM-FLT (980-9IAH0-00XM00) Compatible 1.6T 2xDR4/DR8 OSFP224 RHS/Flat Top PAM4 Broadcom 3nm DSP (Sian3 | BCM83628) 1310nm 500m SMF DOM Dual MPO-12/APC Silicon Photonics Transceiver Module

#103418
Model: OSFP-1.6T-2DR4F
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Types
RoCE (Ethernet)
RoCE (Ethernet)
Transceiver Types
OSFP-1.6T-2DR4F | 500m
OSFP-1.6T-2DR4F | 500m
Brand
NVIDIA/Mellanox (Ethernet)
NVIDIA/Mellanox (Ethernet)
Chip Solutions
Broadcom Sian3 | BCM83628
Broadcom Sian3 | BCM83628

Item Spotlights

  • Built-in Broadcom 3nm DSP (Sian3 BCM83628) and self-developed silicon photonics chips.
  • Maximum power consumption ≤25W.
  • 8x200G-PAM4 electrical modulation.
  • Compliant with OSFP MSA, IEEE 802.3dj_D1.1 protocol and CMIS 5.2.
  • 30-Day Free Return, 1-Year Free Replacement, 3-Year Warranty, Lifetime After-sales Technical Support.
1.6T 2xDR4/DR8 OSFP224 PAM4 1310nm 500m SMF RHS/Flat Top Transceiver for NVIDIA/Mellanox
NVIDIA/Mellanox MMS4A00-XM-FLT (980-9IAH0-00XM00) Compatible 1.6T 2xDR4/DR8 OSFP224 RHS/Flat Top PAM4 Broadcom 3nm DSP (Sian3 | BCM83628) 1310nm 500m SMF DOM Dual MPO-12/APC Silicon Photonics Transceiver Module
Specifications
Applications
Questions & Answers
Specifications
Applications
Questions & Answers

Description

NVIDIA/Mellanox MMS4A00-XM-FLT (980-9IAH0-00XM00) Compatible 1.6T 2xDR4/DR8 Silicon Photonics Optical Transceiver (Twin-port OSFP224, Broadcom 3nm DSP – Sian3 BCM83628, 1310nm, 500m, OS2, Dual MPO-12/APC, DOM, SMF, RHS/Flat Top)

NADDOD OSFP-1.6T-2DR4F is a 1.6Tb/s twin-port OSFP224 optical transceiver compatible with NVIDIA/Mellanox MMS4A00-XM-FLT (980-9IAH0-00XM00) , supporting Ethernet networks with 2 × 800Gb/s links. It is designed for high-performance data center interconnects and next-generation HPC applications. The 1.6T OSFP 2xDR4 transceiver features a parallel 8-channel design (2 × DR4/DR8) over single-mode fiber, utilizing 200G-PAM4 electrical and optical modulation. Each port connects via a 4-channel MPO-12/APC optical connector, enabling 800Gb/s per connector. The module supports a maximum fiber reach of 500 meters over 8 single-mode fibers, providing reliable medium-distance links within the data center. The OSFP224 housing incorporates a Flat Top / RHS design for improved heat management and stable operation in densely packed switch environments.

Built on silicon photonics chip, the 1.6T OSFP 2xDR4 transceiver achieves higher integration, lower power consumption, and greater port density, while the Broadcom 3nm Sian3 (BCM83628) DSP delivers robust PAM4 signal processing with ultra-low bit error rates (BER) and stable link performance, enabling reliable, low-latency 800G/1.6T interconnects. This module is ideal for 1.6T liquid-cooled switch-to-switch interconnects, providing high-bandwidth, low-latency links in AI, and HPC data center networks.

Specifications

Form Factor
OSFP224
Distance
500m
Wavelength
1310nm
Connector
Dual MPO-12/APC
Power Consumption
≤25W
Transmitter
DFB (SiPh Based)
Receiver
PIN (SiPh Based)
Media
SMF
Modulation (Electrical)
8x212Gb/s PAM4
Modulation (Optical)
Two ports 4x212Gb/s PAM4
Case Temperature (℃)
0 to 70°C (32 to 158°F)
Protocol
1.6T Ethernet Compliant

Applications

Questions & Answers

Ask a Question
Q:
What are the differences between 1.6T finned top and flat top transceivers?
A:
The Finned Top (IHS) version has metal heat-dissipating fins on top, ideal for air-cooled architectures with excellent thermal performance. The Flat Top (RHS) version has a completely flat top without fins, designed for liquid-cooled cold plate compression cooling scenarios.
Q:
Can the 1.6T 2xDR4 OSFP224 flat top transceiver be used with NVIDIA QM9700 switches?
A:
No. The transceiver and the switch have mismatched SerDes speeds and form factor requirements. The QM9700 features 8x100G SerDes, while the 1.6T 2xDR4 transceiver features 8x212G SerDes. What's more, the QM9700 only supports finned top transceivers, but this model features a flat top design, making the two incompatible.
Q:
Is the 1.6T Flat Top transceiver compatible with air-cooled platforms?
A:
No. The Flat Top transceiver has no active heat dissipation structure and relies on cold plate heat conduction, so it is only suitable for liquid-cooled architectures. Air-cooled platforms only support the Finned Top version.
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Quality Certification

ISO140012015
ISO 90012015
ISO450012018
FDA
FCC
CE
RoHS
TUV-Mark
UL
WEEE

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