Modules QSFP56 200G Liquide/Immersion

OCP has launched ESUN, a new workstream collaboration aimed at building a low-latency, high-bandwidth AI cluster interconnect architecture based on open Ethernet standards. By uniting multiple industry partners, the initiative promotes standardization collaboration and ecosystem integration, providing a unified network foundation for next-generation AI infrastructure.

Liquid cooling technology is reshaping the data center cooling landscape. This article introduces liquid cooling technology roadmaps, the NVIDIA GB200/GB300 liquid cooling system, and future trends. 👉 Click to read the full article!

NADDOD's 800G/400G/200G immersion cooling transceivers, featuring advanced sealing technology and compatibility with industry-standard fluids, deliver efficient heat dissipation and reliable data transmission for AI-powered, high-density liquid-cooled data centers.