800G IB OSFP 트랜시버

Analyzing Broadcom's Sian3 and Sian2M 200G/lane DSP technologies. Sian3 (3nm/SMF) and Sian2M (5nm/MMF) support 800G and 1.6T optical modules, meeting the high bandwidth, low power consumption, and energy-efficient interconnect requirements of AI data center clusters through optimized manufacturing processes and high integration.

This paper systematically reviews the current status and trends of the AI ​​industry in 2025, the structure of the computing power industry chain, commercialization paths, and emerging scenarios such as embodied intelligence and quantum computing. It also analyzes the transition of AI from technology to large-scale application.

This article examines NVIDIA’s interconnect technologies across intra-rack, data center, and inter–data center environments, highlighting how they enable high-bandwidth, low-latency, and predictable communication for large-scale AI and HPC workloads.