800G OSFP 대 OSFP DAC

This paper systematically reviews the current status and trends of the AI ​​industry in 2025, the structure of the computing power industry chain, commercialization paths, and emerging scenarios such as embodied intelligence and quantum computing. It also analyzes the transition of AI from technology to large-scale application.

This article examines NVIDIA’s interconnect technologies across intra-rack, data center, and inter–data center environments, highlighting how they enable high-bandwidth, low-latency, and predictable communication for large-scale AI and HPC workloads.

Recap of Tech Week Singapore 2025: NADDOD showcased 1.6T/800G/400G high-speed optical interconnect products, liquid-cooled optical modules, and full-stack AIDC network solutions, demonstrating its technological strength and influence in global AI network innovation.