NVIDIA/Mellanox Compatible DAC 1m (3ft) Twin-port 2x800Gb/s OSFP224 RHS/Flat Top to Twin-port 2x800Gb/s OSFP224 RHS/Flat Top InfiniBand XDR Passive Copper Cable

#103063
Model: OSFP-1.6T-CU1FH
Sold: 1
In Stock: 37
US$
Brand
NADDOD (InfiniBand)
NADDOD (InfiniBand)
Length
1m (3ft)
1m (3ft)

Item Spotlights

  • 100% verified by the original, perfectly compatible with NVIDIA XDR system.
  • Maximum power consumption 0.1W.
  • 8x 200G-PAM4 electrical modulation.
  • Ultra-low insertion loss ensures no bandwidth bottlenecks in AI clusters.
  • High-shielded copper structure ensures extreme crosstalk & EMI resistance.
  • Compliant with OSFP MSA.
  • 30-Day Free Return, 1-Year Free Replacement, 3-Year Warranty, Lifetime After-sales Technical Support.
1m (3ft) 1.6T OSFP224 RHS/Flat Top InfiniBand XDR Passive Direct Attach Copper for Mellanox
NVIDIA/Mellanox Compatible DAC 1m (3ft) Twin-port 2x800Gb/s OSFP224 RHS/Flat Top to Twin-port 2x800Gb/s OSFP224 RHS/Flat Top InfiniBand XDR Passive Copper Cable
Specifications
Applications
Product Highlights
Questions & Answers
Resources
Specifications
Applications
Product Highlights
Questions & Answers
Resources

Description

NVIDIA/Mellanox Compatible DAC 1m (3ft) Twin-port 2x800Gb/s OSFP224 RHS/Flat Top to Twin-port 2x800Gb/s OSFP224 RHS/Flat Top InfiniBand XDR Passive Copper Cable

NADDOD NVIDIA/Mellanox compatible OSFP-1.6T-CU1FH is a 1m (3ft) 1.6Tb/s passive direct attach copper (DAC) cable supporting 1.6Tb/s (8×200Gb/s PAM4) high-speed transmission, meeting the ultra-high bandwidth demands of next-generation AI training clusters and high-performance computing (HPC) systems. The DAC cable features a flat-top connector design for improving thermal efficiency and ensuring optimal space compatibility in high-density cabling environments.

Passive DAC technology delivers ultra-low latency, near-zero power consumption, high reliability, and a cost-effective interconnect solution for short-reach, rack-level deployments. Typical applications include AI/ML accelerator interconnects, high-speed GPU server-to-server links, 1.6T infiniband XDR network architectures, and other high-bandwidth, short-distance connections within modern data center environments.

Specifications

Form Factor
OSFP224
Cable Length
1m
Wire AWG
26 AWG
Commercial Temperature Range
0~70°C (32 to 158°F)
Jacket Material
PET
Power Consumption
<0.1W
Minimum Bend Radius
10xOD
Application
IB XDR, 1.6T Ethernet Compliant

Applications

Product Highlights

Why NADDOD

  • Module Availability
    Worry-Free - Rigorous authentic testing!
  • Multi-version Device Compatibility
    Multi-Version - Easy adaptation for each module!
  • High-Performance
    Actual Test Data-Better results intuitively!

Our Approach

Test scene
All tests were conducted in a real XDR environment to validate compatibility, connectivity, and reliability. NADDOD 1.6T DAC was tested on the NVIDIA ConnectX-8 NIC, maintaining stable operation during the tests. These tests confirm that the DAC provides consistent, low-latency connectivity for XDR clusters.
Test result
NVIDIA ConnectX-8 C8180 (900-9X81E-00EX-ST0) NIC
Software Version: 40.45.1200
  • Multi-Version
    NIC Side Testing
    Multi-Version Testing
    NADDOD 1.6T DAC operates seamlessly across multiple software versions of the ConnectX-8 NIC, ensuring plug and play in real XDR clusters.
  • Connectivity
    NIC Side Testing
    Connectivity Testing
    NADDOD 1.6T DAC keeps the connected NIC ports up without link interruptions, providing consistent, low-latency connectivity for XDR clusters.
  • BER
    NIC Side Testing
    BER Testing
    In BER tests, NADDOD 1.6T DAC maintains an ultra-low BER, ensuring reliable data transmission for demanding XDR workloads.
Test result
Test result
Test result

Questions & Answers

Ask a Question
Q:
What are the differences in form factor between the OSFP224 Flat-Top and the standard OSFP? Why is the Flat-Top design adopted?
A:
The Flat-Top structure features a reduced top height, enabling superior airflow paths and cold plate clearance in high-density environments such as liquid-cooled servers and back-to-back densely arranged switches, thereby enhancing heat dissipation efficiency. Additionally, it minimizes obstruction and supports a more compact front panel layout.
Q:
What are the main application scenarios of the OSFP-1.6T-CU1FH?
A:
It is mainly used for interconnection between ConnectX-8 NICs.
Q:
Is the OSFP-1.6T-CU1FH compatible with OSFP switches?
A:
No. This cable features a flat top/RHS design, while the cable required on the switch side must be the OSFP-1.6T-CU0-9H with a finned top design.
View More

Quality Certification

ISO140012015
ISO 90012015
ISO450012018
FDA
FCC
CE
RoHS
TUV-Mark
UL
WEEE

What We Supply