NVIDIA/Mellanox MMA4Z00-NS-FLT Broadcom DSP & Broadcom VCSEL Compatible 800G OSFP 2xVR4/VR8 850nm 50m PAM4 DOM Two MPO-12/APC MMF Transceiver Module (Flat Top) for ConnectX-8 C8180 SuperNIC

#103238
Model: OSFP-800G-2VR4F | SKU: 980-9I51A-00NS00
Sold: 490
In Stock: 400
US$

Item Spotlights

  • Built-in Broadcom DSP & Broadcom VCSEL, Maximum Power Consumption ≤14W.
  • Provide Professional Compatibility and Parameter Test Reports.
  • Compliant with Hot Pluggable OSFP MSA Standard.
  • Compliant with RoHS Environmental Standard (Lead-free).
  • DDM(Digital Diagnostic Monitoring) Supported.
  • Pairing with the C8180 Super NIC enables quad-Plane topology networking and effectively improves link stability.
  • 30-Day Free Return, 1-Year Free Replacement, 3-Year Warranty, Lifetime After-sales Technical Support.
800G OSFP VR8 50m MMF Module for NVIDIA/Mellanox (Flat Top)
NVIDIA/Mellanox MMA4Z00-NS-FLT Broadcom DSP & Broadcom VCSEL Compatible 800G OSFP 2xVR4/VR8 850nm 50m PAM4 DOM Two MPO-12/APC MMF Transceiver Module (Flat Top) for ConnectX-8 C8180 SuperNIC
Specifications
Applications
Product Highlights
Questions & Answers
Resources
Specifications
Applications
Product Highlights
Questions & Answers
Resources

Description

NVIDIA/Mellanox MMA4Z00-NS-FLT Compatible Broadcom DSP & Broadcom VCSEL 800G 2xVR4/VR8 Optical Transceiver Module for ConnectX-8 C8180 SuperNIC (Twin-port OSFP, 850nm, 50m, Two MPO-12/APC, DOM, for MMF, Flat Top)

NADDOD NVIDIA/Mellanox MMA4Z00-NS-FLT compatible OSFP-800G-2VR4F optical transceiver is designed for 800Gb/s Ethernet interconnects, using a twin-port OSFP architecture to support 2×400Gb/s VR4/VR8 multimode transmission over an 8-channel parallel optical interface. The module operates via two MPO-12/APC connectors, with each connector carrying four optical lanes, and uses 100G-PAM4 modulation to enable short-reach transmission of up to 50 meters over multimode fiber. Built-in Broadcom DSP & Broadcom VCSEL, it is compatible with NVIDIA ConnectX-8 C8180 SuperNIC, ensuring reliable, high-speed data transmission in demanding deployments.

By adopting a parallel multimode VR4/VR8 design, the OSFP-800G-2VR4F enables high port density and efficient short-reach connectivity within 800G switching systems. Finned-top OSFP shells are supported to meet the additional cooling requirements of 800G OSFP switches, while a flat-top variant is available for ConnectX-8 system links, providing deployment flexibility across different platform designs.

Specifications

Form Factor
Twin-port OSFP
Distance
50m
Wavelength
850nm
Connector
Two MTP/MPO-12 APC
Power Consumption
≤14W
Transmitter
VCSEL
Receiver
PIN
Media
MMF
Modulation(electrical)
8x106.25Gb/s PAM4
Modulation(Optical)
Two ports 4x106.25Gb/s PAM4
Case Temperature(℃)
0 to 70°C (32 to 158°F)
Protocol
800G Ethernet Compliant

Applications

Product Highlights

ConnectX-8 Multi-Plane Architecture Unlocks Extreme Cluster Performance

The OSFP-800G-2VR4F module is tightly integrated with the C8180 SuperNIC’s multi-plane architecture, delivering key advantages in large-scale computing clusters. By distributing traffic across multiple planes, it maximizes bandwidth, enables smoother load balancing, and ensures consistently low latency. Each plane is isolated and inherently redundant, so a single path failure does not impact service continuity, enhancing overall reliability. With higher resource utilization and fewer congestion points, the ConnectX-8 architecture enables faster scaling and a more efficient, stable, and resilient network experience.

The Cost-Efficient, High-Performance C8180 SuperNIC Solution

In ConnectX-8 NIC and Spectrum-4 switch AI cluster architectures, the C8180 paired with OSFP-800G-2VR4F reduces optical module count by 20% compared with the C8240 using Q112-400G-VR4 solution. This delivers the following three key advantages.

Questions & Answers

Ask a Question
Q:
What is the difference between Flat top and Finned-top OSFP 800G 2xVR4 optical modules?
A:
The "Flat Top" 800G OSFP module is mainly used in the ConnectX-8 NIC, which have internal heat sinks mounted on top of the cages. The "Finned Top" optical module form factor utilizes a module top design with heat sink fins to increase heat dissipation and improve module performance and reliability in high-temperature environments, and is typically used in air-cooled switches for additional cooling due to the reduced airflow inlet in the switch.
Q:
Are the specifications of the OSFP-800G-2xVR4F identical to those of the OSFP-800G-2xVR4? Are they compatible for interconnection?
A:
Yes, these two modules share identical parameter specifications. The difference lies in their heat dissipation methods. They can be connected using two M4MPOA12FB jumpers.

Quality Certification

ISO140012015
ISO 90012015
ISO450012018
FDA
FCC
CE
RoHS
TUV-Mark
UL
WEEE

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