Divisores DAC XDR 1.6T OSFP224 a 2x800G OSFP224

This paper systematically reviews the current status and trends of the AI ​​industry in 2025, the structure of the computing power industry chain, commercialization paths, and emerging scenarios such as embodied intelligence and quantum computing. It also analyzes the transition of AI from technology to large-scale application.

This system analyzes the cluster interconnection architecture of NVIDIA B200/B300/GB200/GB300, covering DGX, NVL72 form factors and SuperPod topology design, to help understand cluster deployment methods.

Discover how 3nm DSP chips enable 1.6T optical modules with lower power, ultra-low BER, and higher integration—driving the future of AI data centers.